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potting compound , electronic potting compound , silicone potting
compound ,electrical potting compound , thermal potting compound ,
electronic silicone potting compound
Antiflaming heat conductive potting compound HM-9160H
1、product description
HM-9160H is condensed type two-component organic silicon sealing materia to be cured at room temperature.This material will give off Ethanol molecules while curing,but there is no corrosion to PC、PP、ABS、PET、PVC、copper wire, aluminum, tin. It has good adhesion to most of the electric components(except for PP and PC material ).
2、 Features
·Gray color, low viscosity, good levelling property, can be applied to mould pressing for most of complicated electric components.
·After curing it will turn to rubber-like look with high-strength, impact resistanc, heat conduction and inflaming retarding properties(V-0).
·with excelent performanc: heat resistance, moisture resistance, cold tolerance, it can prolong the life time for the electric components.
·Condensed type, the discharged Ethanol molecules has no corrosion to the electric parts.
·It needs no undercoat and has perfect adhesion to PC、PET、Epoxy、PPO、PVDF material.
·Good heat conducting property.
3、Application
·Deep potting for power module and electric parts.
·Potting for electric parts which need heat conducting and inflaming retarding .
4、 Parameters
Phisical property before mixing(25℃,65%RH) |
||
component |
HM-9160 (A) |
HM-9160(B) |
color |
gray |
Semitransparent solution |
viscosity(cP) |
6000(25℃) |
20-50 |
specific gravity(g/ CM3) |
Appr 1.54 |
Appr 0.98 |
Phisical property after mixing(25℃,65%RH) |
||
Mixing ratio(weight) |
A:B = 10:1 |
|
color |
gray color |
|
Viscosity after mixing(CP) |
2800(25℃) |
|
Quantitative levelling(20ml)≥10.5cm |
12.8cm |
|
operation time(min) |
45(25℃) |
|
Initial curing time(h) |
4 |
|
Full hardening time (h) |
24 |
|
Cured 7 d,25℃,65%RH |
||
Hardness(HSA) |
35±5 |
|
Shrinkage ratio(%) |
0.3 |
|
Using temperature range(℃) |
-45~200 |
|
Volume resistivity(Ω·cm) |
1.0×1015 |
|
Dielectric strength(KV/mm) |
≥20 |
|
Thermal conductivity(W/(m·K)) |
≥0.6 |
|
Max tensile strength(MPa ) |
≥1.5 |
|
Elongatioin at break(% ) |
≥80 |
|
Antiflaming(UL94) |
V-0 |
*viscosity, color and curing time is subject to user’s requirements
potting compound , electronic potting compound , silicone potting
compound ,electrical potting compound , thermal potting compound ,
electronic silicone potting compound
5、instructions of use
Mixing A,B parts according to proportion A:B=10:1 on the basis of weight until evenly then potting in the right postion. After initial curing at room temperature(appr 2-4 hours) can move to next process. If part A has sediments to come please mix it well to continue using.
6、Packaging and storage
·Packaging: A:20kg B:2kg
·Storage period: 12 month, sealed and put in dried, shady and cool place
7、 Notes
This product is non-toxic,don’t get touch to eyes and children before curing. Keep the working place ventilated always. Owing to the application condition and place is out of our control, please conduct a test before using.
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广东皓明有机硅材料有限公司 Tel:0086-757-82711390 Fax:0086-757-82711390 E-mail:marketing1@hm-sil.com Add:Lianhua Development Zone,Dinghu District,Zhaoqing City,Guangdong,China. |