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Potting compound for LED power driver HM-9160
Key:electronic potting compound ​,Potting compound for LED power driver ,solar silicone encapsulant ​​
Characteristic: electronic potting compound ​,Potting compound for LED power driver ,solar silicone encapsulant ​​
Hotline:0086-757-82711390
        Introduction

electronic potting compound ,Potting compound for LED power driver ,solar silicone encapsulant 




Potting compound for LED power driver

HM-9160 Product Information

Features

Room temperature cure or rapid hot cure., solvent-free or byproduct-free ,limited contractility ;

Flame retardant.

Excellent thermal conductive property and dielectric property.

Stable and flexible from-50to200.

Typical properties:

Item

HM-E-9160

 

A

B

Color

gray

White

Mixed ratio

1

1

Viscosity /mPa·s

3400

2000

Specific gravity

1.53

Curing time

24h/25℃,1h/70

Operation time

120min/25

Hardnees /Shao A

65

Dissipation factor

0.003

Dielectric constant

3.0

Volume resistivity /Ω·cm

1015

Dielectric strength/kV/mm

18

Thermal conductivity/W/m/K

0.6

Elongation/%

90

Flame rating

UL94V-0

 

Note: this product is affected by the temperature , the higher the temperature, shorter operation time and shorter curing time

 

Mixing

The two components should be thoroughly mixed using a weight or volume ratio of 1:1 until the mixture has a uniform color.To make sure the mixture is even,suggest that agitate per A and B respectively before mixing up.Pour the complete mixed material into the target potting side, normally you don’t need to use vacuum to release the bubble, but if high thermal conductivity is needed,suggest that use vacuum at -0.08MPa or above, release the bubble under vacuum environment for about 5-10min first then apply the potting.

Attention:

1, This produce cure with the help of catalyst platinum, sulfide, nitrogen, sulfur, phosphorus and organic tin compound may inhibit curing process .We suggest that before applying our product ,pls clean the residue of rosin on circuit board and try use low lead solder.


2, choose the room temperature curing process, it is suggested that let the mixture sit still for more than 60 mins to release the bubble before applying in order to obtain the best performances.
3, select heating curing process, it is suggested that the vacuum deaeration, then filling, heat curing, to obtain the best performance.
4, avoid direct contact with epoxy adhesive, polyurethane adhesive, condensation silicone ,which could affect the curing process .

5, should be carried out perfusion within the operating time , base material or electronic components surface should be clean and dry before perfusion .
6, this product is a  non-dangerous goods, but forbid to direct contact with mouth and eyes .

 

 

Usable life and storage

Base A and curing agent B has a shelf life of 9 months from the date of manufacture respectively. Pls completely mix the A and B separately before use.

 


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Contact HOMEEN
广东皓明有机硅材料有限公司
Tel:0086-757-82711390
Fax:0086-757-82711390
E-mail:marketing1@hm-sil.com
Add:Lianhua Development Zone,Dinghu District,Zhaoqing City,Guangdong,China.