high temperature potting compound HM-6601 Key：high temperature potting compound,potting glue,encapsulating compound​​​ Characteristic： high temperature potting compound,potting glue,encapsulating compound​​​ HM-6601A/B product is formed by two parts potting adhesive, with 1.41 refractive index. Normally used as potting adhesive in LED patch, and high power LED module encapsulation. Hotline：0086-757-82711390

high temperature potting compound,potting glue,

encapsulating compound

Haoming is a leading chinese manufacturer for one component and two components silicone sealant ,which are widly used in craft ,LED,Solar PV ,consumer electronics ,automobile,etc.Our products include silicone rubber, RTV-2 mold making silicone, RTV liquid silicone rubber,thermal conductive silicone potting compound,electronic silicone conformal coating,silicone encapsulant,electronic silicone sealant,general purpose neutral silicone sealant,gasket silicone sealant.

HM-6601A/B

Directions：

HM-6601A/B product is formed by two parts potting adhesive, with 1.41 refractive index. Normally used as potting adhesive in LED patch, and high power LED module encapsulation.

Parameters：

Instructions for use：

1.        Use the A、B parts according to their mass proportion of 1:1 and conduct the production in the dried and dust-free cirsumstance.

2.        Stir by Planetary gravity mixer to make it uniform mixing or emove air bubbles from the adhesive at the room temperature with 100Pa vacuum deegree before using .

3.        Before adhesive dispensing please clean the bracket thoroughly to get rid of the material which may hinder curing of adhesiv from the baseplate.

4.        The bracket should be heated at 150℃ for 30 minutes for dehumidification before injection adhesive, and please dispense adhesive before the rack absorb moisture again.

5.        After adhesive injection put the LED bracket into the vacuum chamber with 100Pa vacuum degree to remove the bubbles(around 5 min)

6.        After adhesive injection bake in a 100℃ oven 1 for 1-2 hours to be completely cured.

7.        Put the untapped adhesive in the spotless container for later use.

Notes：

1.        HM-6101A/B is addition type siliconeelastome,which should not touch some maertial such as alkyne,lead,tin,cadmiu,mercury and other heavy metal which may cause uncured or partialy curde.The potting suface must be cleaned before sealing and filling.

2.        Different operation will result in various consequences may lead to bubble,barrier,debonding,crack etc. Please refer to associated personel to avoid above occurrence.

3.        Better the vacuumizer is an open system and never use for epoxy resin.The best way is to establish a dedicated organic silicon production line.

4.        Please use appropriate container and stirring rod for mixing. And don’t wear silicon glove to get touch the silicon.

5.        Due to the condistion and method is out of our control, this file can not be used to replace test,in case there is any query for the material whether hinder curing,just conduct a small compatibility test to ascertain its appropriateness for special application or consult our company technical staff.

high temperature potting compound,potting glue,

encapsulating compound

Storage and transportation:

1.        Keep in dark and dried place in room temp.

Expiration date 6 months. If all technical tests are remain ok after expiration date it can be used normally as well.

2.        This product can be shipped as non-dangerous chemicals.

3.        A,B parts should be sealed for storage,don’t make any leakage during transporation.

packaging：

A part：0.5kg/busket；1kg/butket

B part：0.5kg/busket；1kg/bucket